Yonghong Yang
Changyun Zhu
Introduction
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analysis must be embedded within IC design flow. Many methods of integrated circuit thermal analysis suffer performance or accuracy problems that prevent use in IC synthesis and hinder use in architectural design.
ISAC is a comprehensive IC chip-package thermal analysis software package developed by researchers from Queen's University and Northwestern University. ISAC is based on novel, adaptive, numerical analysis methods. Compared to other thermal analysis solutions, ISAC achieves orders of magnitude speedup without loss of accuracy.
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Publication
Y. Yang, Z. Gu, C. Zhu, L. Shang, and R. P. Dick, "Adaptive Chip-Package Thermal Analysis for Synthesis and Design," Proc. Conf. on Design, Automation, and Test in Europe, Mar. 2006. (pdf)
Y. Yang, C. Zhu, Z. Gu, L. Shang, and R. P. Dick, "Adaptive Multi-Domain Thermal Modeling and Analysis for Integrated Circuit Synthesis and Design," Proc. Int. Conf. on Computer-Aided Design, Nov. 2006. (pdf)
Y. Yang, Z. P. Gu, C. Zhu, R. P. Dick, and L. Shang, ˇ§ISAC: Integrated Space and Time Adaptive Chip-Package Thermal Analysis,ˇ¨ to appear in IEEE Trans. Computer-Aided Design. (pdf)
Patent disclosure
L. Shang, R. Dick, and Y. Yang, ˇ§Adaptive Analysis Methods,ˇ¨ patent pending, Parteq Innovations and Northwestern University, Mar. 2006.
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